Effect of Thickness on Properties of Copper Thin Films Growth on Glass by DC Planar Magnetron Sputtering

Copper thin films with nano-scale structure have numerous applications in modern technology. In this work, Cu thin films with different thicknesses from 50–220 nm have been deposited on glass substrate by DC magnetron sputtering technique at room temperature in pure Ar gas. The sputtering time was considered in 4, 8, 12 and 16 min, respectively. The thickness effect on the structural, morphological and electrical properties were studied by X-ray diffraction (XRD), atomic force microscope (AFM) and four point probe (FPP) measurements, respectively. The results show that by increasing thickness, the copper films crystallinity in (111) direction increases. Also by varying the films thickness the significant changes were observed in the films surface morphology due to the mechanism of films growth. Finally, the relationship between film resistivity and Cu film thickness are investigated in this paper.