Analytical Investigation of Induced Stresses on Solder Joints of Electronic Boards under Random Vibration

The satellites on the ground during construction and transportation, in launching stage and operation in space are under various types of dynamic loads, including high and low frequency vibrational loads, acoustics, shock, impact, etc., each of which can be an important source in the creation of stress on the satellite. The satellite components should be designed in such a way that can continue to operate while facing these situations. Electronic boards, in particular their solder joints, are critical components of satellites. Therefore, investigation of damage in design process of boards have great importance. Loading pattern on the satellite during its operation is usually random which considered as quasi-static load. Improvement of the design of the satellite against the weaknesses shown while facing different loads is essential, and given the fact that it is time consuming and costly to carry out laboratory tests, the use of analytical methods for checking the strength and lifetime of the structure can be very useful. In this research, random vibrations environment is equivalent to pseudo-static loads, and using the multilayer plate theory, the stresses in solder joints and failure of joints under this loading will be investigated. Also, the effect of parameters such as electronic board width and the boundary condition of the printed circuit board on the solder joints' stress will be considered in analytical solution.