Investigation of material removal rate and surface quality of super clear crystal glass workpiece in the ultrasonic machining process

In recent years, the oscillations use of ultrasonic waves has been strongly increased in various industries. Therefore, respecting to the application type of these waves in different industrial fields, extensive and wide researches have been started which can be helpful and competent in optimizing the effective parameters in methods based on the ultrasonic waves application. One of the special uses of them is in machining. The ultrasonic machining is a mechanical material removal which is applied for creating various holes and cavities on the brittle and fragile materials. In this study, in order to ensure the practical behavior of the machine, be able to investigate the resulted findings and also obtain the optimized machining parameters, the drilling operation was performed on the glass workpiece of super clear crystal type by designing the experiment. The results in different conditions show that the material removal has been increased by increasing the frequency, the static load and the machining power. The highest material removal has been achieved by choosing a frequency of 40 kilohertz, static load of 1080 grams and power of 130 watts. Also, the created holes have a desirable quality of roundness tolerance.