جستجوی مقالات مرتبط با کلیدواژه "interfacial crack" در نشریات گروه "فنی و مهندسی"

The design of space operations must be done carefully. Because the smallest mistake in the design and construction of the spacecraft causes heavy financial losses. Electronic boards are one of the most important components of electronic systems in any operation. These boards must continue to operate under the applied loading. Strong levels of random vibrations can cause damage and fracture in electronic boards. The random vibration field applied to the electronic board can be modeled by mixed-mode I/II loading. Solder joints are very sensitive components of satellites. Fracture of electronic packages often occurs due to cracking in the joint between the electronic board and the solder under mixed-mode I/II loading. In this research, a new fracture criterion based on the maximum tangential stress is presented to predict the fracture for the interfacial crack between the electronic board and the solder. Based on the presented criterion, the direction and moment of crack initiation are predicted for the interfacial crack between isotropic and orthotropic materials. In this way, the fracture limit curve can be drawn. By comparing the presented criterion with the available experimental data, it can be concluded that the presented criterion has sufficient validity to evaluate the prediction of fracture in interfacial cracks between isotropic and orthotropic materials.

The sandwich panel is a combination of a soft core and two stiff, high-strength facesheets. In many cases, the connection between the facesheet and the core is considered as a critical point that can damages the integrity of the sandwich structure. In this study, the debonding toughness between the facesheet and the core in sandwich beams with grooved cores made of Kevlar 49/polyester facesheets and polyurethane foam core has been measured experimentally. The values ​​of the strain energy release rate obtained at the onset of crack growth for the tested specimens are in the range of 340 (J/Square meters) and increase with the crack growth up to 500 (J/Square meters). One of the innovations of the present study is to investigate the effect of grooving the core of the sandwich panel on the resistance of the structure to the growth of interfacial cracks. The results show that by placing the groove inside the core of the sandwich panel, the interfacial crack stops during growth by hitting each groove and requires higher force to restart its growth. This phenomenon increases the resistance of this type of structure against the growth of cracks in the face/core area. In this research, a model based on cohesive zone theory was used to simulate crack growth in the tested specimens. Comparison of load-displacement curves obtained from the analysis shows that the proposed model has a good ability to predict the behavior of the structure under similar loading conditions.