Investigation of co-deformation behavior of copper and silver layer in Cu-Ag multilayer composite produced by accumulative roll bonding method

Metallic multilayers have drawn worldwide attention in recent years since they exhibit many attractive characteristics in mechanical, electrical and magnetic properties. In this research Cu-Ag multilayer composites were produced by accumulative roll bonding (ARB) method. The variation of layer structure during ARB cycles and codeformation of Cu and Ag layer were studied by scaning electron microscopy(SEM). The results showed that the continuity of the constituent layer remained intact until the end of the ninth cycles. During codeformation of layers the copper hard phase necked and the silver soft phase undulated. finally, factors affecting layer continuity and codeformation were investigated