Thermal dependence of thermal conductivity of particleboard containing Ag and Cu nanoclouids

The purpose of this study was to investigate the effect of silver and copper nanoclouids on the thermal conductivity of particleboard. For this purpose, nanoclouids with concentration of 4000 (ppm) in four levels of 0, 5, 10 and 15% were applied to the particleboards with the consumed resin, then thermal conductivity of the boards were measured at four temperature profiles (45, 50, 55 and 60 °C). The results showed that with increasing nanoclouids content, the thermal conductivity increased, and the samples containing silver nanoclouids indicate higher thermal conductivity than the samples containing copper nanoclouids at the same conditions. With increasing temperature, thermal conductivity of the boards increased. The increased of thermal conductivity of compact wooden plates was as a positive factor in production process in terms of cost reducing and increase efficiency of the products.