Outplane stress analysis of a functionally graded strip bounded with two elastic half plane including several finite cracks in interfacial zone between the strip and half plane

In this paper, analyses of several finite cracks in bonded materials with a graded interfacial zone were studied. The distributed dislocation technique is used to carry out stress analysis for two elastic half planes bonded through a non-homogeneous interfacial zone under anti-plane loading. The solution is obtained by means of Fourier transform method. The stress components reveal the familiar Cauchy singularity at the location of dislocation. Finally several examples are solved and the numerical results for the stress intensity factor are obtained. The influences of the geometric parameters, the thickness of the functionally graded strip and the crack size have significant effects on the stress intensity factors of crack tips which are displayed graphically.