Use of Soy Flour-Tannin Adhesive for Particleboard (Dry Condition)

In this research soy flour- tannin adhesives were used in particleboard preparation, successfully. Tow type of different tannins Mimosa (as condensed tannin) and Chestnut (as hydrolysable tannins) were used for soy resin modification. For this purpose, mimosa and chestnut tannin were added to soy adhesive with 5, 10 and 15 percent based on dry weight of soy flour. 9 percent Glyoxal was used based on dry weight of tannin for accelerate tannin reaction’s with soyflour components. Prepared soy-tannin adhesives were used in particle board manufacturing with 350×300×14 mm3 dimansion and 0.7 g/cm3 nominal density. Results of viscosity measurment showed that addition of each of tannins decreased visocosity of soy adhesive. In this study, result of thermo-mechanical analyze indicated that chestnut cloud improve adhesion behavior of soy adhesive better than mimosa. Also, Using of tannins in soy adhesive composition increase internal bonding and bending properties in manufactured particleboards.