Use of Modified Soy Adhesive for Manufacturing Fiberboard from Wood and OCC Fiber

Due to the environmental problems of formaldehyde gas emission, governments, manufacturers and scientific societies are looking for a solution to replace urea-formaldehyde adhesive by non-formaldehyde one for wood composites. So, this research was conducted on the feasibility of using old corrugated container fibers and tannin improved soy flour-based adhesive in green fiberboard production. For this reason, Tannic acid (as hydrolysable tannin) by 10 wt% was used as a modifier for soy adhesive and old corrugated container fibers were used in 0, 25, 50 and, 75 wt% based on the dry weight. The results of FTIR showed the chemical bonding between tannin ingredient and soy amino acids by forming a possible covalent bond. Also, the results showed that the physical and mechanical properties of manufactured raw fiberboard did not meet the EN 622-5 standard. Moreover, results indicated that this type of fiberboard needs more investigation, especially in the dry process. These manufactured boards have good potential to be used as a core material in wall and roof sandwich panels without any formaldehyde emission but more improvements are needed in physical and mechanical properties.